Designers of military equipment, from naval vessels to soldier equipment, face the constant challenges of reducing weight, saving space, and achieving more efficient use of power. TE will be featuring products that are evolving to help achieve SWaP goals at AUSA 2011 on 10-12 October at Booth 7153 (Hall D) in Washington, DC. Among the products featured are:
- Six-row Fortis Zd high-speed backplane connectors that support data rates of 12+ Gb/s and are now offered in lighter, lower-pin-count versions
- CeeLok FAS-T circular connectors, supporting 10-Gb/s ethernet in a lightweight, compact size 8 M38999 interface
- VITA 66 and 67 optical and RF modules for VPX systems providing high-density backplane connectivity for optical MT, expanded beam, and ARINC 801 optical interfaces and SMPM RF interfaces
- VITA 66 and 67 optical and RF modules for VPX systems providing high-density backplane connectivity for optical MT, expanded beam, and ARINC 801 optical interfaces and SMPM RF interfaces
- High-performance wire and cable using advanced thin-wall insulation and jackets to reduce size and diameter significantly
- Power distribution modules, custom designed to meet demanding application-specific form-and-fit SWaP requirements
"TE has a long tradition of helping the defense industry reduce size and weight," says Gregory Powers, market development manager at TE. "In today's world of network-centric warfare and advanced signal intelligence, savings in weight, space, and power become ever more critical in supporting mission readiness. Whether it's new and lighter composites, space-saving thin-wall insulations, or improved processing to engineer and produce smaller connectors, relays, and other components, we are committed to meeting ever-evolving needs."
