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Extreme Engineering Solutions (X-ES) Introduces the XPand6104 Small Form Factor COM Express system

Friday, November 02, 2012 by Sarsen Technology

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The natural convection-cooled XPand6104 is an Intel® Core™ i7 processor COM Express system based on the XPedite7450 module.

With commercial connectors, this SFF system can be utilized as an XPedite7450 COM Express development platform, a deployable SFF system, or a demo platform for applications requiring a high-performance Intel Core i7 processor solution.

At 5.3cm (H) x 12.4cm (W) x 19.6cm (L), and weighing less than 2kgs, the XPand6104 is ideal for Size, Weight, and Power (SWaP)-constrained applications. It includes an XPedite7450 Intel(R) Core(TM) i7 ruggedized COM Express module, and an optional 4.6cm SSD provides the convenience of high-capacity off-the-shelf storage and the ruggedness of solid-state non-volatile memory. An Ethernet port, two serial ports, a USB port, graphics port, and a SATA port from the XPedite7450 are brought out to standard commercial connectors on the front panel.

Features include:

  • Natural convection-cooled small form factor
  • Includes XPedite7450, a ruggedized Intel® Core™ i7 processor COM Express module
  • Optional 1.8 in. or Slim SATA SSD memory module
  • Integrated MIL-STD-704 28 V DC input voltage power supply with MIL-STD-461 EMI filtering
  • Standard commercial front panel I/O connectors
  1. One RJ-45 Ethernet connector to 10/100/1000BASE-T Gigabit Ethernet port
  2. One USB 2.0 connector to USB 2.0 port
  3. One eSATA connector to SATA 3.0 Gb/s port
  4. Two micro DB-9 connectors to RS-232 serial ports
  5. One DisplayPort connector for graphics
  6. Reset and power switches
  7. Status LEDs
  • - Back panel power connector