DDC Introduces Thermally Enhanced Micro-ACE-TE MIL-STD-1553 Terminals
05 October 2004 12:08
Data Device Corporation is expanding its popular Micro-ACE ball grid array (BGA) series of MIL-STD-1553 terminals with the new thermally enhanced Micro-ACE-TE series. “The new thermally enhanced series operates over an extended industrial temperature range (-40°100°C) providing plenty of thermal margin on the high side for use in PC board designs that need to operate over industrial temperature ranges” indicated Todd Decker, Marketing Manager for DDC’s Data Networking Products.
The Micro-ACE-TE series of components include new alternatives that up until now were not available on DDC’s Micro-ACE product line. They are available in 3.3V (single power supply) version in addition to the more familiar 5V option. They also offer a new PCI interface option as well as the standard a generic processor interface. Like it’s predecessor, Micro-ACE-TE is extremely small using less than half the board real estate of DDC’s smallest ceramic products, making it the smallest 1553 integrated terminals in the industry.
“When you’re designing components for military and avionics systems, keeping it small has many advantages” noted Steve Friedman, Data Bus Product Manager at DDC. “Designers have only so many square inches to work with and going from a one-inch-square gull lead to a 0.8 inch-square Micro-ACE TE uses 65% less real estate on the card. Also, eliminating the need for a 5V power supply in 3.3V systems saves considerable space, weight and cost at all levels of the system. “
The Micro-ACE-TE devices are available in eight versions. Designers can choose from any combination of 3.3V or 5V power supplies, either 4K X 16 or 64K X 17 memory and Generic Processor or PCI interface. All Micro-ACE-TE devices support BC/RT/MT modes and the full feature set of DDC’s Enhanced Mini-ACE protocol engine. Therefore Micro-ACE-TE devices are 100% software compatible with all of DDC’s previous generations of ACE, Mini-ACE, Enhanced Mini-ACE, and Micro-ACE series of products.
The BGA package uses an FR-4 material that identically matches the temperature coefficient of PC boards to maintain excellent structural integrity in environments that see a high degree of thermal cycling. COTS Micro–ACE-TE devices are rated to a level 3 moisture tolerance in accordance with JEDEC standard-020. All of DDC's Micro-ACE products are fully compliant with MIL-STD-1553A/B and STANAG 3838 and MIL-STD-1760.
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